Status and Outlooks of Flip Chip Technology
نویسنده
چکیده
Introduction The flip chip technology was introduced by IBM in the early 1960s for their solid logic technology, which became the logical foundation of the IBM System/360 computer line [1]. Figure 1(a) shows the first IBM flip chip with three terminal transistors, which are Ni/Au plated Cu balls embedded in a Sn–Pb solder bump on the three I/O pads of transistor. A Cr–Cu– Au adhesion/seed layer is deposited between the Al–Si contact pads on the Si chip and the solder bump. Figure 1(b) shows the first IBM flip chip assembly (three chips) on a ceramic substrate.
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